ELECTROMIGRATION OF NI IN AL THIN-FILM CONDUCTORS

被引:12
作者
DHEURLE, FM [1 ]
GANGULEE, A [1 ]
ALIOTTA, CF [1 ]
RANIERI, VA [1 ]
机构
[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
关键词
D O I
10.1063/1.321515
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:4845 / 4846
页数:2
相关论文
共 18 条
[1]   SUR LEELECTROLYSE DES ALLIAGES METALLIQUES [J].
BOSVIEUX, C ;
FRIEDEL, J .
JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1962, 23 (JAN-F) :123-&
[2]  
BOUTIN FR, COMMUNICATION
[3]  
d'Heurle F.M., 1972, NATURE BEHAVIOR GRAI, P339
[4]   EFFECTS OF MG ADDITIONS ON ELECTROMIGRATION BEHAVIOR OF AL THIN-FILM CONDUCTORS [J].
DHEURLE, FM ;
GANGULEE, A ;
ALIOTTA, CF ;
RANIERI, VA .
JOURNAL OF ELECTRONIC MATERIALS, 1975, 4 (03) :497-515
[5]   MASS-TRANSPORT DURING ELECTROMIGRATION IN ALUMINUM-MAGNESIUM THIN-FILMS [J].
GANGULEE, A ;
DHEURLE, FM .
THIN SOLID FILMS, 1975, 25 (02) :317-325
[6]   EFFECT OF ALLOY ADDITIONS ON ELECTROMIGRATION FAILURES IN THIN ALUMINUM FILMS [J].
GANGULEE, A ;
DHEURLE, FM .
APPLIED PHYSICS LETTERS, 1971, 19 (03) :76-&
[7]  
Gjostein N. A., 1973, DIFFUSION, P272
[8]  
Hansen M., 1958, CONSTITUTION BINARY, P118
[9]   KIRKENDALL STUDY OF ELECTROMIGRATION IN THIN-FILMS [J].
HO, PS ;
LEWIS, JE ;
HOWARD, JK .
THIN SOLID FILMS, 1975, 25 (02) :301-315
[10]   GRAIN-BOUNDARY SOLUTE ELECTROMIGRATION IN POLYCRYSTALLINE FILMS [J].
HO, PS ;
HOWARD, JK .
JOURNAL OF APPLIED PHYSICS, 1974, 45 (08) :3229-3233