SURFACE-MOUNT PLATING PROBLEMS

被引：0

作者：

POSKANZER, AM

机构：

来源：

PLATING AND SURFACE FINISHING | 1987年 / 74卷 / 10期

关键词：

D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

页码：20 / +

页数：1

共 50 条

[1] ELECTROLESS PLATING FOR SURFACE-MOUNT TECHNOLOGY
POSKANZER, AM
PLATING AND SURFACE FINISHING, 1987, 74 (06): : 12 - +
[2] SURFACE-MOUNT CONNECTORS SURMOUNT INTEGRATION PROBLEMS.
Kawabe, Natsuki
JEE. Journal of electronic engineering, 1986, 23 (234): : 30 - 32
[3] SURFACE-MOUNT MODULATORS
不详
MICROWAVE JOURNAL, 1994, 37 (07) : 128 - 128
[4] Surface-mount connectors
Larson, Dave
Circuits Assembly, 1996, 7 (06):
[5] SURFACE-MOUNT TECHNOLOGY
POSKANZER, AM
PLATING AND SURFACE FINISHING, 1987, 74 (04): : 20 - 20
[6] SURFACE-MOUNT TECHNOLOGY
ORMOND, T
EDN MAGAZINE-ELECTRICAL DESIGN NEWS, 1985, 30 (09): : 105 - &
[7] Surface-mount anachronisms
Zarrow, Phil
Circuits Assembly, 2002, 13 (12): : 16 - 17
[8] SURFACE-MOUNT CONNECTORS
BECKER, L
CONNECTOR SPECIFIER, 1995, 11 (01): : 10 - 13
[9] SURFACE-MOUNT TECHNOLOGY
LEIBSON, SH
EDN, 1986, 31 (20) : 134 - &
[10] PACKAGE VARIATIONS CREATING PROBLEMS FOR USERS OF SURFACE-MOUNT TECHNOLOGY
DIXON, T
ELECTRONIC PRODUCTS MAGAZINE, 1985, 27 (23): : 25 - 26