A REVIEW OF CORROSION FAILURE MECHANISMS DURING ACCELERATED TESTS - ELECTROLYTIC METAL MIGRATION

被引：89
作者：
STEPPAN, JJ
ROTH, JA
HALL, LC
JEANNOTTE, DA
CARBONE, SP
机构：
[1] VANDERBILT UNIV, DEPT CHEM, NASHVILLE, TN 37235 USA
[2] IBM CORP, E FISHKILL FACIL, HOPEWELL JUNCTION, NY 12533 USA
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1987年 / 134卷 / 01期
关键词：
D O I：
10.1149/1.2100401
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
引用
收藏
页码：175 / 190
页数：16
相关论文
共 152 条
[71]   SILVER MIGRATION IN ELECTRICAL INSULATION [J].
KOHMAN, GT ;
HERMANCE, HW ;
DOWNES, GH .
BELL SYSTEM TECHNICAL JOURNAL, 1955, 34 (06) :1115-1147
[72]  
KOLESAR SC, 1974, 12TH ANN P REL PHYS, P155
[73]  
KOYANAGI S, 1957, J ELECTROCHEM SOC JP, V25, pE102
[74]  
KOYANAGI S, DENKI KAGAKU, V25, P489
[75]   THE ELECTRODEPOSITION OF COPPER SILVER AND COPPER NICKEL-ALLOY POWDERS FROM AQUEOUS AMMONIACAL SOLUTIONS [J].
KUHN, AT ;
NEUFELD, P ;
YOUNG, K .
JOURNAL OF APPLIED ELECTROCHEMISTRY, 1984, 14 (05) :605-613
[76]  
Lahti J. N., 1979, 17th Annual Proceedings Reliability Physics, P39, DOI 10.1109/IRPS.1979.362869
[77]  
Lando D. J., 1979, 17th Annual Proceedings Reliability Physics, P51, DOI 10.1109/IRPS.1979.362871
[78]  
LASCARO CP, 1970, IEEE T MATERIALS PAC, V60
[79]  
LEE HPE, 1981, THESIS U CALIFORNIA
[80]  
LEE HPE, 1983, THESIS U CALIFORNIA
3456789101112