IMPROVED THERMAL-CONDUCTIVITY IN MICROELECTRONIC ENCAPSULANTS

被引：57
|
作者：
PROCTER, P [1 ]
SOLC, J [1 ]
机构：
[1] DOW CHEM CO USA,CENT RES,MIDLAND,MI 48640
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1991年 / 14卷 / 04期
关键词：
D O I：
10.1109/33.105121
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The relationship of thermal conductivity with crucial properties of polymer-based encapsulants have been investigated. Selection of the filler and the resultant filler content in semiconductor grade molding compound are discussed in view of the practical limitations of composite thermal conductivity. Theoretical predictions of the Nielsen model are considered. The temperature dependence of composite thermal conductivity has been measured and the effects of different types of polymer matrices on the temperature dependence are shown. Practical semiconductor grade molding compounds resulting from this work are under current investigation.
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页码：708 / 713
页数：6
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