OXIDATION AND PROTECTION IN COPPER AND COPPER ALLOY THIN-FILMS

被引:232
作者
LI, J [1 ]
MAYER, JW [1 ]
COLGAN, EG [1 ]
机构
[1] IBM CORP,E FISHKILL FACIL,DIV GEN TECHNOL,HOPEWELL JUNCTION,NY 12533
关键词
D O I
10.1063/1.349344
中图分类号
O59 [应用物理学];
学科分类号
摘要
The oxidation kinetics of copper thin films have been studied at temperatures below 200-degrees-C in air. The protection of copper from oxidation can be achieved by alloying copper film with Ti, Pd, Cr, or Al. The influence of the composition and microstructure to the oxidation rate has been studied. The compounds Cu3Ti, Cu3Pd, and CuAl2 are stable in the oxidation ambient. The formation of Cr-oxide, which is a passive oxide, explains the inhibition of oxidation on Cu-Cr films. Compared with the crystalline phase, the amorphous Cu-65Ti35 alloy film is more oxidation resistant. A TiN layer with oxygen incorporated is more effective in preventing copper oxidation than a TiN layer without oxygen incorporated. A passivating Si3N4 layer on copper thin films can prevent copper oxidation effectively at 350-degrees-C in oxygen ambient.
引用
收藏
页码:2820 / 2827
页数:8
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