INVESTIGATION OF TIN FILMS REACTIVELY SPUTTERED USING A SPUTTER GUN

被引：58
作者：
AHN, KY
WITTMER, M
TING, CY
机构：
来源：
THIN SOLID FILMS | 1983年 / 107卷 / 01期
关键词：
D O I：
10.1016/0040-6090(83)90006-8
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：45 / 54
页数：10
相关论文
共 19 条
[1]   OBSERVATIONS OF STRESSES IN THIN-FILMS OF PALLADIUM AND PLATINUM SILICIDES ON SILICON [J].
ANGILELLO, J ;
HEURLE, FD ;
PETERSON, S ;
SEGMULLER, A .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1980, 17 (01) :471-475
[2]   THERMAL-STABILITY OF TITANIUM NITRIDE FOR SHALLOW JUNCTION SOLAR-CELL CONTACTS [J].
CHEUNG, NW ;
VONSEEFELD, H ;
NICOLET, MA ;
HO, F ;
ILES, P .
JOURNAL OF APPLIED PHYSICS, 1981, 52 (06) :4297-4299
[3]  
Chu WK., 1978, BACKSCATTERING SPECT
[4]  
HARPER JE, 1982, COMMUNICATION
[5]  
HO PS, 1976, AIP C P, V29, P39
[6]   ZRN DIFFUSION BARRIER IN ALUMINUM METALLIZATION SCHEMES [J].
KRUSINELBAUM, L ;
WITTMER, M ;
TING, CY ;
CUOMO, JJ .
THIN SOLID FILMS, 1983, 104 (1-2) :81-87
[7]  
Kubaschewski O., 1979, METALLURGICAL THERMO
[8]  
NELSON CW, 1969, 1969 P INT S HYBR MI
[9]   DIFFUSION BARRIERS IN THIN-FILMS [J].
NICOLET, MA .
THIN SOLID FILMS, 1978, 52 (03) :415-443
[10]   TIN AS A DIFFUSION BARRIER BETWEEN COSI2 OR PTSI AND ALUMINUM [J].
SCHUTZ, RJ .
THIN SOLID FILMS, 1983, 104 (1-2) :89-99
12