MATERIALS ISSUES IN COPPER INTERCONNECTIONS

被引：75
作者：
HARPER, JME
COLGAN, EG
HU, CK
HUMMEL, JP
BUCHWALTER, LP
UZOH, CE
机构：
[1] IBM CORP,THOMAS J WATSON RES CTR,TECHNOL INTEGRAT GRP,YORKTOWN HTS,NY 10598
[2] IBM CORP,THOMAS J WATSON RES CTR,THIN FILM MET & INTERCONNECT GRP,YORKTOWN HTS,NY 10598
来源：
MRS BULLETIN | 1994年 / 19卷 / 08期
关键词：
D O I：
10.1557/S0883769400047709
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
[No abstract available]
引用
收藏
页码：23 / 29
页数：7
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