ROLE OF TIN CONTENT IN THE WETTING OF CU AND AU BY TIN-BISMUTH SOLDERS

被引：20

作者：

POWERS, TA ^{[1
]}

SINGLER, TJ ^{[1
]}

CLUM, JA ^{[1
]}

机构：

[1] SUNY BINGHAMTON,CTR MECH & IND ENGN & INTEGRATED ELECTR ENGN,BINGHAMTON,NY 13902

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1994年 / 23卷 / 08期

关键词：

METALLIZATION; SOLDERS; TIN CONTENT; WETTING;

D O I：

10.1007/BF02651372

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This study describes tests in which solder composition, substrate metallization, temperature, and dwell time were combined in a factorially designed experiment to determine the effect of those factors on solder spread area. Measure of spread area, reflowed solder shape, solder microstructure, and solder and interface chemistry were taken in order to provide insight about the wetting mechanism(s). The reactivity of Au vs Cu metallization with solder was found to be a major factor in increasing spread area. The role of increasing tin content is to increase spread and spread rate. A similar effect is seen by increasing temperature. Time allowed for spread is a minor contributor to the spread area. Segregation of the tin and bismuth solder components during the wetting process was observed which indicated the role of bismuth as a carrier species. Analysis of variance methods based on the statistically designed experiments1a, 1b were used to show how to generate a model which estimates the spread area as a function of the tested factors.

引用

页码：773 / 778

页数：6

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