LOW-TEMPERATURE COMPOUND FORMATION IN CU/SN THIN-FILM COUPLES

被引：20

作者：

CHOPRA, R ^{[1
]}

OHRING, M ^{[1
]}

OSWALD, RS ^{[1
]}

机构：

[1] AIRCO INC,CENT LABS,MURRAY HILL,NJ 07974

来源：

THIN SOLID FILMS | 1982年 / 94卷 / 04期

关键词：

D O I：

10.1016/0040-6090(82)90490-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：279 / 288

页数：10

共 14 条

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[9] INTERFACIAL VOID STRUCTURE OF AU-SN-AL METALLIZATIONS ON GA-AL-AS LIGHT-EMITTING-DIODES [J].

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