INTERFACIAL ROUGHNESS IN HIGH-FREQUENCY MICROELECTRONIC INTERCONNECTIONS AND PACKAGING

被引：2

作者：

BHASIN, KB ^{[1
]}

WARNER, JD ^{[1
]}

LIU, DC ^{[1
]}

ROMANOFSKY, RR ^{[1
]}

机构：

[1] NASA,LEWIS RES CTR,CLEVELAND,OH 44135

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1985年 / 3卷 / 03期

关键词：

D O I：

10.1116/1.573305

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

收藏

页码：778 / 779

页数：2

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