REACTION PATHWAYS AND SOURCES OF OH GROUPS IN LOW-TEMPERATURE REMOTE PECVD SILICON DIOXIDE THIN-FILMS

被引:29
|
作者
THEIL, JA [1 ]
TSU, DV [1 ]
LUCOVSKY, G [1 ]
机构
[1] N CAROLINA STATE UNIV,DEPT MAT SCI & ENGN,RALEIGH,NC 27695
关键词
Chemical vapor deposition; dielectric thin films; OH in silica; plasma enhanced chemical vapor deposition; silicon dioxide; SiO[!sub]2[!/sub; SiO[!sub]2[!/sub] ir spectroscopy;
D O I
10.1007/BF02651747
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Silicon oxides deposited by remote plasma-enhanced chemical-vapor deposition (Remote PECVD) can be grown under conditions which produce hydrogen-free SiO2, and under conditions which promote the incorporation of bonded-hydrogen in either SiH or SiOH groups, but generally not in both. In this paper, we investigate the relationship between the deposition conditions leading to OH incorporation, and other post-deposition pathway(s) by which OH can also be incorporated. Two ways by which OH can be incorporated into the oxides are by: (i)intrinsic pathways which are associated with the heterogeneous chemical reactions responsible for film growth; and (ii)extrinsic pathways which refer to incorporation after film deposition stops. The results of our experiments to date show no evidence to support the intrinsic process; all of the infrared (ir) detectable OH is shown to derive from post-deposition or extrinsic sources. We have found two distinct post-deposition sources, one from the deposition chamber ambient during cool-down and one from atmospheric moisture. Each of these sources has a particular spectroscopic signature. We show that OH incorporated from atmospheric moisture occurs as spatially correlated near-neighbor Si-OH groups, whereas OH groups incorporated in the deposition chamber ambient are randomly distributed in the SiO2 host material. © 1990 The Mineral,Metal & Materials Society,Inc.
引用
收藏
页码:209 / 217
页数:9
相关论文
共 25 条
  • [21] LOW-TEMPERATURE POLY-SI TFTS USING SOLID-PHASE CRYSTALLIZATION OF VERY THIN-FILMS AND AN ELECTRON-CYCLOTRON RESONANCE CHEMICAL VAPOR-DEPOSITION GATE INSULATOR
    LITTLE, TW
    TAKAHARA, K
    KOIKE, H
    NAKAZAWA, T
    YUDASAKA, I
    OHSHIMA, H
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1991, 30 (12B): : 3724 - 3728
  • [22] Effect of N2O/SiH4 flow ratio on properties of SiOx thin films deposited by low-temperature remote plasma-enhanced chemical deposition
    Kim, D. J.
    Hwang, J. Y.
    Kim, T. J.
    Lee, N.-E.
    Kim, Y. D.
    SURFACE & COATINGS TECHNOLOGY, 2007, 201 (9-11): : 5354 - 5357
  • [23] Low-temperature growth (400°C) of high-integrity thin silicon-oxynitride films by microwave-excited high-density Kr-O2-NH3 plasma
    Ohtsubo, K
    Saito, Y
    Hirayama, M
    Sugawa, S
    Aharoni, H
    Ohmi, T
    IEEE TRANSACTIONS ON PLASMA SCIENCE, 2004, 32 (04) : 1747 - 1751
  • [24] Low-temperature formation of thin-gate SiO2 films by the ultrahigh-vacuum chemical vapor deposition with reduced subcutaneous oxidation using remote-plasma-activated oxygen and Si2H6
    Kanamoto, K
    Yoshida, T
    Oizumi, T
    Murai, A
    Kurabayashi, T
    Nishizawa, J
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2001, 40 (10): : 6059 - 6064
  • [25] ROOM-TEMPERATURE, HIGH-DEPOSITION-RATE, PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION OF SILICON OXYNITRIDE THIN-FILMS PRODUCING LOW SURFACE DAMAGE ON LATTICE-MATCHED AND PSEUDOMORPHIC III-V QUANTUM-WELL STRUCTURES
    SAH, RE
    RALSTON, JD
    EICHIN, G
    DISCHLER, B
    ROTHEMUND, W
    WAGNER, J
    LARKINS, EC
    BAUMANN, H
    THIN SOLID FILMS, 1995, 259 (02) : 225 - 230