PLASMA-ETCHING MECHANISM OF SILICON STUDIED BY MASS-SELECTED ION-BEAM IRRADIATION TECHNIQUE

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TACHI, S
MIYAKE, K
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JAPAN ANNUAL REVIEWS IN ELECTRONICS COMPUTERS & TELECOMMUNICATIONS | 1984年 / 13卷
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TP3 [计算技术、计算机技术];
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0812 ;
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页码:343 / 357
页数:15
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共 30 条
[1]  
BEENAKKER CIM, 1982, 3RD P S PLASM PROC, P401
[2]  
BOLDWIN DA, 1982, APPL SURF SCI, V11, P222
[3]   REACTIVE ION-BEAM ETCHING OF SIO2 AND POLYCRYSTALLINE SILICON [J].
BROWN, DM ;
HEATH, BA ;
COUTUMAS, T ;
THOMPSON, GR .
APPLIED PHYSICS LETTERS, 1980, 37 (02) :159-161
[4]  
BRUCE RH, 1980, ELECTROCHEM SOC M ST, P243
[5]   ION-SURFACE INTERACTIONS IN PLASMA ETCHING [J].
COBURN, JW ;
WINTERS, HF ;
CHUANG, TJ .
JOURNAL OF APPLIED PHYSICS, 1977, 48 (08) :3532-3540
[6]   SOME CHEMICAL ASPECTS OF THE FLUOROCARBON PLASMA ETCHING OF SILICON AND ITS COMPOUNDS [J].
COBURN, JW ;
KAY, E .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1979, 23 (01) :33-41
[7]  
DONNELLY VM, 1981, SOLID STATE TECHNOL, V24, P161
[8]   DRY ETCHING FOR VLSI - A REVIEW [J].
EPHRATH, LM .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (03) :C62-C66
[9]   MEASUREMENT OF PLASMA DISCHARGE CHARACTERISTICS FOR SPUTTERING APPLICATIONS [J].
ESER, E ;
OGILVIE, RE ;
TAYLOR, KA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (02) :199-202
[10]  
FLAMM DL, 1978, J APPL PHYS, V49, P3796