AN IMPROVED APPROACH TO ELECTROLESS COPPER DEPOSITION ON NON-CONDUCTING SUBSTRATES

被引：2

作者：

VIJAYARAGHAVAN, MS

机构：

来源：

关键词：

D O I：

10.1016/0038-1101(84)90037-6

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：828 / 829

页数：2

共 7 条

[1]

BERENATO J, 1967, Patent No. 6614993

[2]

BHATGADDE LG, 1980, P INDIAN AS-ENG SCI, V3, P67

[3]

BHATGADDE LG, 1977, METAL FINISHING, V12, P28

[4] RATE OF ELECTROLESS COPPER DEPOSITION BY FORMALDEHYDE REDUCTION [J].

DUMESIC, J ;

KOUTSKY, JA ;

CHAPMAN, TW .

[5]

GOLDIE W, 1968, METALLIC COATING PLA

[6] NUCLEATION, GROWTH, AND STRUCTURE OF ELECTROLESS COPPER DEPOSITS [J].

SARD, R .

[7]

SAUBESTRE EB, 1959, P AM ELECTROPLATERS, V46, P264