SOME MECHANISMS OF ACTION OF ADDITIVES IN ELECTRODEPOSITION PROCESSES

被引：105
作者：
FRANKLIN, TC [1 ]
机构：
[1] BAYLOR UNIV, DEPT CHEM, WACO, TX 76798 USA
来源：
SURFACE & COATINGS TECHNOLOGY | 1987年 / 30卷 / 04期
关键词：
ELECTRODES; ELECTROCHEMICAL - Surface Properties;
D O I：
10.1016/0257-8972(87)90133-2
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
A review is given of mechanisms by which additives have been postulated to affect the rate of deposition of metals. These mechanisms include blocking the surface, changes in Helmholtz potential, complex formation including induced adsorption and ion bridging, ion pairing, changes in interfacial tension and filming of the electrode, hydrogen evolution effects, hydrogen absorption, anomalous codeposition and the effect on intermediates.
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收藏
页码：415 / 428
页数：14
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