ADVANCES IN MATERIALS AND PROCESSES FOR PRINTED-CIRCUIT PACKAGING TECHNOLOGY - PREFACE

The foundation of advanced electronic packaging manufacturing processing is primarily based on materials and engineering sciences and includes almost all of the basic disciplines of the materials scientist. The papers in this volume include studies in materials characterization, analytical chemistry, polymer chemistry, electrochemical reactions, surface phenomena, diffusion and permeation, mechanics, and metallurgy. The authors emphasize the tradition of close collaboration between the inventors and implementers, and that the goal of this collaboration was to establish a long-term set of improvements through fundamental materials, process, and design actions to allow continued incremental increases in density and performance.