XPS OF ORGANIZED MOLECULAR ASSEMBLY COPPER INTERFACES - HS(CH2)11OH/CU

The interaction of evaporated copper overlayers with the terminal hydroxyl functional group of an organized molecular assembly (OMA) of HS(CH2)11OH has been studied by X-Tay photoelectron spectroscopy (XPS). An analysis of constituent core level and Auger spectra shows that a limited amount of Cu oxide is formed at low coverage and is accompanied by a Cu(0) component that grows rapidly with increasing copper coverage. Carbon and oxygen line-shape changes are consistent with the low-coverage interaction of Cu with the COH functional group of the OMA. The peak intensities fit models in which for coverages below 0.5 nm the deposited copper resides at the OH surface of the OMA, but at higher coverages copper penetrates into the OMA and reaches the OMA/Au interface.