THE ROLE OF METAL AND PASSIVATION DEFECTS IN ELECTROMIGRATION-INDUCED DAMAGE IN THIN-FILM CONDUCTORS

被引：37
作者：
LLOYD, JR
SMITH, PM
PROKOP, GS
机构：
来源：
THIN SOLID FILMS | 1982年 / 93卷 / 3-4期
关键词：
D O I：
10.1016/0040-6090(82)90144-4
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：385 / 395
页数：11
相关论文
共 50 条
  • [41] ELECTROMIGRATION OF TI-AU THIN-FILM CONDUCTORS AT 180-DEGREES C
    ENGLISH, AT
    TAI, KL
    TURNER, PA
    JOURNAL OF APPLIED PHYSICS, 1974, 45 (09) : 3757 - 3767
  • [42] Dependence of electromigration-induced failure lifetimes on NiFe thin-film thickness in giant magnetoresistive spin-valve read heads
    Bae, S
    Judy, JH
    Tsu, IF
    Davis, M
    Murdock, ES
    APPLIED PHYSICS LETTERS, 2001, 79 (22) : 3657 - 3659
  • [43] ORGANIC THIN-FILM CONDUCTORS
    VOLLMANN, W
    STUDIA BIOPHYSICA, 1989, 132 (1-2): : 119 - 126
  • [44] Electromigration-induced plastic deformation in passivated metal lines
    Valek, BC
    Bravman, JC
    Tamura, N
    MacDowell, AA
    Celestre, RS
    Padmore, HA
    Spolenak, R
    Brown, WL
    Batterman, BW
    Patel, JR
    APPLIED PHYSICS LETTERS, 2002, 81 (22) : 4168 - 4170
  • [45] THIN-FILM DEFECTS INDUCED BY GLASS SUBSTRATES
    PULKER, HK
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1965, 2 (05): : 277 - &
  • [46] Electromigration in thin-film solder joints
    Ho, C. E.
    Yang, C. H.
    Hsu, L. H.
    SURFACE & COATINGS TECHNOLOGY, 2014, 259 : 257 - 261
  • [47] Electromigration-induced resistance changes in gold thin film metallization in III-V devices
    Bai, S
    Roenker, KP
    COMPOUND SEMICONDUCTOR POWER TRANSISTORS AND STATE-OF-THE-ART PROGRAM ON COMPOUND SEMICONDUCTORS (SOTAPOCS XXIX), 1998, 98 (12): : 222 - 237
  • [48] DISTRIBUTIONS OF ACTIVATION-ENERGIES FOR ELECTROMIGRATION DAMAGE IN THIN-FILM ALUMINUM INTERCONNECTS
    SCHWARZ, JA
    JOURNAL OF APPLIED PHYSICS, 1987, 61 (02) : 798 - 800
  • [49] EFFECTS OF COPPER ON ELECTROMIGRATION IN ALUMINUM THIN FILM CONDUCTORS
    AMES, I
    HEURLE, FD
    HORSTMAN.R
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1970, 117 (08) : C262 - &
  • [50] An optical microscopy imaging method for detection of electromigration-induced damage
    Li, LH
    Piecuch, C
    Hiatt, J
    Setlik, B
    Heskett, D
    MICROELECTRONIC ENGINEERING, 2004, 75 (03) : 252 - 256
12345