PLASMA-ASSISTED DEPOSITION PROCESSES - THEORY, MECHANISMS AND APPLICATIONS

被引:56
作者
THORNTON, JA
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D O I
10.1016/0040-6090(83)90003-2
中图分类号
T [工业技术];
学科分类号
08 ;
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页码:3 / 19
页数:17
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共 75 条
[1]  
ALLIS W, 1960, PLASMA DYNAMICS, P54
[3]   A REVIEW OF RECENT WORK ON HARD I-C FILMS [J].
ANDERSSON, LP .
THIN SOLID FILMS, 1981, 86 (2-3) :193-200
[4]   FLUORINE DOPING OF IN2O3 FILMS EMPLOYING ION-PLATING TECHNIQUES [J].
AVARITSIOTIS, JN ;
HOWSON, RP .
THIN SOLID FILMS, 1981, 80 (1-3) :63-66
[5]   DEPOSITION OF POLYMER-FILMS IN LOW-PRESSURE REACTIVE PLASMAS [J].
BIEDERMAN, H .
THIN SOLID FILMS, 1981, 86 (2-3) :125-135
[6]   DISSOCIATIVE ATTACHMENT OF ELECTRONS IN IODINE .1. MICROWAVE DETERMINATION OF THE ABSOLUTE CROSS SECTION AT 300-DEGREES-K [J].
BIONDI, MA .
PHYSICAL REVIEW, 1958, 109 (06) :2005-2007
[7]  
BONIFIELD TD, 1982, DEPOSITION TECHNOLOG, P365
[8]  
BROWN SC, 1959, BASIC DATA PLASMA PH, P149
[9]   ACTIVATED REACTIVE EVAPORATION PROCESS FOR HIGH RATE DEPOSITION OF COMPOUNDS [J].
BUNSHAH, RF ;
RAGHURAM, AC .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (06) :1385-&
[10]  
BUNSHAH RF, 1982, DEPOSITION TECHNOLOG, P83