POLYMERIZATION BEHAVIOR OF SILVER-FILLED EPOXY RESINS BY RESISTIVITY MEASUREMENTS

被引：24
|
作者：
MILLER, B
机构：
来源：
JOURNAL OF APPLIED POLYMER SCIENCE | 1966年 / 10卷 / 02期
关键词：
D O I：
10.1002/app.1966.070100204
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
引用
收藏
页码：217 / &
相关论文
共 50 条
  • [41] Discoloration Mechanism of Silver-filled Adhesive used for Packaging Solder Joint
    Rao, Zhenzhen
    Bao, Shengxiang
    Lai, Weiming
    Shi, Guanghua
    Li, Peng
    Ye, Jianhai
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 874 - 876
  • [42] Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization
    Jiang, HJ
    Moon, KS
    Lu, JX
    Wong, CP
    JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (11) : 1432 - 1439
  • [43] Electroconductive adhesives based on epoxy and polyurethane resins filled with silver-coated inorganic fillers
    Novák, I
    Krupa, I
    Chodák, I
    SYNTHETIC METALS, 2004, 144 (01) : 13 - 19
  • [44] CHEMORHEOLOGY OF UNFILLED AND FILLED EPOXY-RESINS
    NG, H
    MANAS-ZLOCZOWER, I
    POLYMER ENGINEERING AND SCIENCE, 1993, 33 (04): : 211 - 216
  • [45] Silver-filled polyethersulfone membranes for antibacterial applications - Effect of PVP and TAP addition on silver dispersion
    Basri, H.
    Ismail, A. F.
    Aziz, M.
    Nagai, K.
    Matsuura, T.
    Abdullah, M. S.
    Ng, B. C.
    DESALINATION, 2010, 261 (03) : 264 - 271
  • [46] Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization
    Hongjin Jiang
    Kyoung-Sik Moon
    Jiongxin Lu
    C. P. Wong
    Journal of Electronic Materials, 2005, 34 : 1432 - 1439
  • [47] Properties of silver-filled acrylate photopolymer layers prepared by a heterogeneous photocatalytic polymerisation reaction
    Damm, C.
    Muenstedt, H.
    SURFACE & COATINGS TECHNOLOGY, 2008, 202 (21): : 5122 - 5126
  • [48] Measurement of sheet resistivity on silver nanoparticles-filled epoxy conductive ink using thermoplastic polyurethane
    Kamel, N. A. S. Mahamad
    Salim, M. A.
    Omar, G.
    1ST COLLOQUIUM PAPER: ADVANCED MATERIALS AND MECHANICAL ENGINEERING RESEARCH (CAMMER'18), 2018, : 5 - 7
  • [49] Polymerization of epoxy resins studied by positron annihilation
    Suzuki, T
    Hayashi, T
    Ito, Y
    MATERIALS RESEARCH INNOVATIONS, 2001, 4 (5-6) : 273 - 277
  • [50] Polymerization of epoxy resins studied by positron annihilation
    Suzuki, T
    Hayashi, T
    Ito, Y
    ACTA PHYSICA POLONICA A, 1999, 95 (04) : 671 - 676
12345