MICROMACHINING WITH THE EXCIMER-LASER

Excimer laser boots the performances for material processing and micromachinning applications. Because of short emission wavelenght ( in the UV range ), short pulse width ( 15 ns ) and high peak power ( > 100 MW/cm2) during laser emission; thermal effect during material interaction with laser radiation are negligible. This gives new possibilities of high resolution (# 1 mum) micromachining of hard and fragile materials such metals, single-cristals, ceramics ... and the aspect ratio is as high as 10.