MICROMACHINING WITH THE EXCIMER-LASER

被引：0
|
作者：
DAMIANI, D
CATHERINOT, A
机构：
[1] IND LASER PARTNER,F-87310 ST LAURENT GORRE,FRANCE
[2] FAC SCI LIMOGES,URA 320,F-87000 LIMOGES,FRANCE
来源：
ANNALES DE PHYSIQUE | 1992年 / 17卷 / 03期
关键词：
D O I：
10.1051/anphys/1992010
中图分类号：
O4 [物理学];
学科分类号：
0702 ;
摘要：
Excimer laser boots the performances for material processing and micromachinning applications. Because of short emission wavelenght ( in the UV range ), short pulse width ( 15 ns ) and high peak power ( > 100 MW/cm2) during laser emission; thermal effect during material interaction with laser radiation are negligible. This gives new possibilities of high resolution (# 1 mum) micromachining of hard and fragile materials such metals, single-cristals, ceramics ... and the aspect ratio is as high as 10.
引用
收藏
页码：57 / 58
页数：2
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