SILVER DISSOLUTION ON COPPER-BASED ALLOYS

被引：10

作者：

ADORNO, AT ^{[1
]}

BEATRICE, CRS ^{[1
]}

BENEDETTI, AV ^{[1
]}

CABOT, PL ^{[1
]}

机构：

[1] UNIV BARCELONA,FAC QUIM,DEPT QUIM FIS,E-08028 BARCELONA,SPAIN

来源：

JOURNAL OF MATERIALS SCIENCE | 1993年 / 28卷 / 02期

关键词：

Aluminum alloys - Copper alloys - Dissolution - Electric resistance measurement - Scanning electron microscopy;

D O I：

10.1007/BF00357818

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Electrical resistivity measurements and scanning electron microscopy was used to study the dissolution of silver on Cu-Ag and Cu-Al-Ag alloys. The results seem to indicate that the dissolution temperature is affected by the addition of aluminium.

引用

页码：411 / 414

页数：4

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