SILVER DISSOLUTION ON COPPER-BASED ALLOYS

被引：10

作者：

ADORNO, AT ^{[1
]}

BEATRICE, CRS ^{[1
]}

BENEDETTI, AV ^{[1
]}

CABOT, PL ^{[1
]}

机构：

[1] UNIV BARCELONA,FAC QUIM,DEPT QUIM FIS,E-08028 BARCELONA,SPAIN

来源：

JOURNAL OF MATERIALS SCIENCE | 1993年 / 28卷 / 02期

关键词：

Aluminum alloys - Copper alloys - Dissolution - Electric resistance measurement - Scanning electron microscopy;

D O I：

10.1007/BF00357818

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Electrical resistivity measurements and scanning electron microscopy was used to study the dissolution of silver on Cu-Ag and Cu-Al-Ag alloys. The results seem to indicate that the dissolution temperature is affected by the addition of aluminium.

引用

页码：411 / 414

页数：4

共 5 条

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ADORNO, AT ;

CILENSE, M ;

GARLIPP, W .

JOURNAL OF MATERIALS SCIENCE LETTERS, 1987, 6 (02) :163-164

[2] PHASE-RELATIONSHIPS IN THE COPPER SILVER ALUMINUM TERNARY-SYSTEM, NEAR THE COPPER-RICH CORNER [J].

ADORNO, AT ;

CILENSE, M ;

GARLIPP, W .

JOURNAL OF MATERIALS SCIENCE LETTERS, 1989, 8 (11) :1294-1297

[3]

HANSEN M, 1958, CONSTITUTION BINARY, P1

[4]

MASSALSKI TB, 1973, Z METALLKD, V64, P176

[5]

Panseri C., 1961, ALLUMINIO, V30, P289

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