Modeling the interfacial thermal resistance of diamond nanorod composites and related materials

被引：4

作者：

Whiteside, Tad ^{[1
]}

Priest, Marie A. ^{[2
]}

Padgett, Clifford W. ^{[2
]}

机构：

[1] Savannah River Natl Lab, Aiken, SC 29808 USA

[2] Armstrong Atlant State Univ, Padgett Grp, Savannah, GA 31419 USA

来源：

INTERNATIONAL JOURNAL OF COMPUTATIONAL MATERIALS SCIENCE AND ENGINEERING | 2014年 / 3卷 / 03期

基金：

美国国家科学基金会;

关键词：

Interfacial thermal resistance; carbon nanotube; diamond nanorod; molecular modeling; thermal conductivity;

D O I：

10.1142/S2047684114500146

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper, the effect on the interfacial thermal resistance between a composite system composed of a carbon nanotube or diamond nanorod and an octane matrix by the functionalization of those nanostructures with alkyl chains has been examined using molecular dynamics simulations. The effect of functionalization was studied by varying the percent functionalization from 0.00% to 2.00% using octyl as the functional group. As the percent functionalization increased, both systems showed a decrease in the interfacial thermal resistance. At 1.00% functionalization, as the alkyl chain length was increased from one to eight atoms, the interfacial thermal resistance of the carbon nanotube systems decreased to a minimum, while in the diamond nanorod system the interfacial thermal resistance remained constant.

引用

页数：12

共 20 条

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