HEAT SINK SUBSTRATE SAVES MACHINING COSTS

被引：0

作者：

CHIN, S

机构：

来源：

ELECTRONIC PRODUCTS MAGAZINE | 1993年 / 36卷 / 04期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：22 / 22

页数：1

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