EFFECTS OF INTERFACIAL MICROSTRUCTURE ON UNIFORMITY AND THERMAL-STABILITY OF AUNIGE OHMIC CONTACT TO N-TYPE GAAS

被引：130
作者：
SHIH, YC
MURAKAMI, M
WILKIE, EL
CALLEGARI, AC
机构：
来源：
JOURNAL OF APPLIED PHYSICS | 1987年 / 62卷 / 02期
关键词：
D O I：
10.1063/1.339860
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
引用
收藏
页码：582 / 590
页数：9
相关论文
共 18 条
[1]  
[Anonymous], SEMICOND SEMIMET
[2]   MODELS FOR CONTACTS TO PLANAR DEVICES [J].
BERGER, HH .
SOLID-STATE ELECTRONICS, 1972, 15 (02) :145-&
[3]   OHMIC CONTACTS TO GAAS [J].
BRASLAU, N .
THIN SOLID FILMS, 1983, 104 (3-4) :391-397
[4]   ALLOYED OHMIC CONTACTS TO GAAS [J].
BRASLAU, N .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 19 (03) :803-807
[5]  
Braslau N., 1967, SOLID STATE ELECTRON, V10, P372
[6]   UNIFORM AND THERMALLY STABLE AUGENI OHMIC CONTACTS TO GAAS [J].
CALLEGARI, A ;
PAN, ETS ;
MURAKAMI, M .
APPLIED PHYSICS LETTERS, 1985, 46 (12) :1141-1143
[7]   EQUILIBRIUM DIAGRAM OF SYSTEM GOLD-GALLIUM [J].
COOKE, CJ ;
HUMEROTH.W .
JOURNAL OF THE LESS-COMMON METALS, 1966, 10 (01) :42-&
[8]   VERY LOW RESISTANCE NI-AUGE-NI CONTACTS TO N-GAAS [J].
HEIME, K ;
KONIG, U ;
KOHN, E ;
WORTMANN, A .
SOLID-STATE ELECTRONICS, 1974, 17 (08) :835-&
[9]   ELECTRON-MICROSCOPE STUDIES OF AN ALLOYED AU/NI-AU-GE OHMIC CONTACT TO GAAS [J].
KUAN, TS ;
BATSON, PE ;
JACKSON, TN ;
RUPPRECHT, H ;
WILKIE, EL .
JOURNAL OF APPLIED PHYSICS, 1983, 54 (12) :6952-6957
[10]  
Lahav A., 1985, MATER RES STAND, V37, P641
12