A PARAMETRIC STUDY OF THE ETCHING OF SILICON IN SF6 MICROWAVE MULTIPOLAR PLASMAS - INTERPRETATION OF ETCHING MECHANISMS

被引:63
作者
PETIT, B
PELLETIER, J
机构
[1] UNIV SCI & MED GRENOBLE, CNRS, UNITE 844, MEYLAN, FRANCE
[2] CTR NATL ETUD TELECOMMUN, F-38243 MEYLAN, FRANCE
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 1987年 / 26卷 / 06期
关键词
D O I
10.1143/JJAP.26.825
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:825 / 834
页数:10
相关论文
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