EFFECTS OF DOPED ELEMENTS ON THE CELLULAR PRECIPITATION IN CU-10NI-8SN ALLOY

被引：30
作者：
MIKI, M
OGINO, Y
机构：
[1] Himeji Inst of Technology, Himeji
来源：
MATERIALS TRANSACTIONS JIM | 1994年 / 35卷 / 05期
关键词：
COPPER-NICKEL-TIN ALLOY; CELLULAR PRECIPITATION; DISCONTINUOUS PRECIPITATION; GRAIN BOUNDARY REACTION; AGE-HARDENING; ADDITION OF TITANIUM; ADDITION OF SILICON; ADDITION OF CHROMIUM; ADDITION OF ALUMINUM; ADDITIONAL ELEMENTS;
D O I：
10.2320/matertrans1989.35.313
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The effects of additions of Ti, Si, Cr, Al, Co, Fe, In and Mn on the cellular precipitation in a Cu-10 mass%Ni-8 mass%Sn alloy were investigated by the quantitative metallographic method. The additions of these elements suppressed the nucleation and growth of the grain boundary cell. The addition of Ti, Si, Al and Cr especially suppressed the growth of the cell. Excepting Al and Mn, the elements which showed the larger suppressing effect on the grain growth at solution-treatment temperature also showed the larger suppressing effect on the cell growth at aging temperature. In all of the as-quenched specimens containing additional elements excepting Mn, fine insoluble compound particles such as Ni3Ti and Ni31Si12 phases were observed. Therefore, it is considered that these fine insoluble particles suppressed the grain boundary migration at the solution-treatment temperature and also suppressed the migration of the advancing boundary of the cell at the aging temperature.
引用
收藏
页码：313 / 318
页数：6
相关论文
共 13 条
[1]  
BABURAJ EG, 1970, J APPL CRYSTALLOGR, V12, P476
[2]   DIFFRACTION STUDY OF SPINODAL DECOMPOSITION IN CU-10 W-O NI-6 W-O SN [J].
DITCHEK, B ;
SCHWARTZ, LH .
ACTA METALLURGICA, 1980, 28 (06) :807-822
[3]  
HASHIZUME K, 1988, J JAPAN COPPER BRASS, V27, P193
[4]  
Kamio A., 1990, J JCBRA, V29, P169
[5]   HARDENING BY SPINODAL MODULATED STRUCTURE [J].
KATO, M ;
MORI, T ;
SCHWARTZ, LH .
ACTA METALLURGICA, 1980, 28 (03) :285-290
[6]  
Koster U., 1974, Metal Science, V8, P151
[7]  
KUBOZONO K, 1983, J JAPAN COPPER BRASS, V22, P173
[8]   GRAIN-BOUNDARY REACTION IN A CU-10 MASS-PERCENT-NI-8MASS-PERCENT-SN ALLOY [J].
MIKI, M ;
SOGABE, T ;
HORI, S .
JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1982, 46 (03) :307-312
[9]   EFFECT OF SI ADDITION ON THE CELLULAR PRECIPITATION IN A CU-10NI-8SN ALLOY [J].
MIKI, M ;
OGINO, Y .
MATERIALS TRANSACTIONS JIM, 1990, 31 (11) :968-974
[10]   INFLUENCE OF SOLUTION-TREATMENT CONDITIONS ON THE CELLULAR PRECIPITATION IN SI-DOPED CU-10NI-8SN ALLOY [J].
MIKI, M ;
OGINO, Y .
MATERIALS TRANSACTIONS JIM, 1991, 32 (12) :1135-1140
12