TUTORIAL - ELECTROLYTIC MODELS FOR METALLIC ELECTROMIGRATION FAILURE MECHANISMS

被引：26
作者：
KRUMBEIN, SJ
机构：
[1] AMP Incorporated, Harrisburg
来源：
IEEE TRANSACTIONS ON RELIABILITY | 1995年 / 44卷 / 04期
关键词：
DENDRITIC GROWTH; DENDRITE MIGRATION; ELECTROLYTIC ELECTROMIGRATION; ELECTROMIGRATION; ELECTRONIC FAILURE (ELECTROMIGRATION); FAILURE MECHANISM (ELECTROMIGRATION); LOW-RESISTANCE FAILURE (ELECTROMIGRATION); FILAMENTAL ELECTROMIGRATION; METALLIC MIGRATION;
D O I：
10.1109/24.475971
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Metallic electromigration is the movement of metallic material across a non-metallic medium, under the influence of an electric field, It is increasingly important in the performance & reliability of electronic systems as an underling cause of functional failures in electrical & electronic components. This tutorial discusses the characteristics of the various electromigration mechanisms, with primary emphasis on electrolytically-controlled processes that occur under low power and relatively ambient conditions.
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收藏
页码：539 / 549
页数：11
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