INTERMETALLICS GROWTH AT AL/ALPHA-BRASS INTERFACES

被引：15
作者：
TIMSIT, RS
机构：
来源：
ACTA METALLURGICA | 1985年 / 33卷 / 01期
关键词：
D O I：
10.1016/0001-6160(85)90223-8
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：97 / 104
页数：8
相关论文
共 17 条
[1]  
Baglin J. E. E., 1978, Thin films. Interdiffusion and reactions, P305
[2]  
Bradley AJ, 1938, J I MET, V63, P149
[3]  
CANTALEJOS NA, 1972, J I MET, V100, P20
[4]  
d'Heurle F. M., 1978, Thin films. Interdiffusion and reactions, P243
[5]  
ERSHOV AA, 1977, METALLOVA TERM OBRAB, V5, P19
[6]   INTERDIFFUSION IN AL-CU SYSTEM [J].
FUNAMIZU, Y ;
WATANABE, K .
TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS, 1971, 12 (03) :147-&
[7]   GROWTH-KINETICS OF PLANAR BINARY DIFFUSION COUPLES - THIN-FILM CASE VERSUS BULK CASES [J].
GOSELE, U ;
TU, KN .
JOURNAL OF APPLIED PHYSICS, 1982, 53 (04) :3252-3260
[8]   DIFFUSION-PROCESSES IN THIN-FILMS [J].
GUPTA, D ;
HO, PS .
THIN SOLID FILMS, 1980, 72 (03) :399-418
[9]  
JOLLEY W, 1964, J I MET, V92, P129
[10]   OBSERVATIONS ON THE MECHANISMS OF HIGH-RESISTANCE JUNCTION FORMATION IN ALUMINUM WIRE CONNECTIONS [J].
NEWBURY, D ;
GREENWALD, S .
JOURNAL OF RESEARCH OF THE NATIONAL BUREAU OF STANDARDS, 1980, 85 (06) :429-440
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