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- [2] ELECTROCHEMICAL MECHANISM OF ELECTROLESS COPPER PLATING OF PRINTED-CIRCUIT BOARDS SOVIET ELECTROCHEMISTRY, 1986, 22 (10): : 1288 - 1293
- [4] UNIFORM COPPER DEPOSITION FOR PRINTED-CIRCUIT BOARDS PLATING AND SURFACE FINISHING, 1987, 74 (03): : 62 - 65
- [5] Additives to the electrolyte for copper plating of through-holes in multilayer printed-circuit boards INTERNATIONAL JOURNAL OF CORROSION AND SCALE INHIBITION, 2021, 10 (04): : 1661 - 1676
- [6] HOW-TO-DO-IT - PLATING REPAIR OF PRINTED-CIRCUIT BOARDS PLATING AND SURFACE FINISHING, 1989, 76 (03): : 30 - 32
- [7] THE FUNCTIONAL RANGE OF THE PALLADIUM-CATALYST SYSTEM FOR THE CHEMICAL COPPER PLATING OF PRINTED-CIRCUIT BOARDS METALL, 1983, 37 (03): : 260 - 260