ELECTROMIGRATION IN DOUBLE-LAYER METALLIZATION

被引：5
作者：
WADA, T
HIGUCHI, H
AJIKI, T
机构：
来源：
IEEE TRANSACTIONS ON RELIABILITY | 1985年 / 34卷 / 01期
关键词：
D O I：
10.1109/TR.1985.5221911
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
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页码：2 / 7
页数：6
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