DROP IMPACT ANALYSIS ON THE PACKAGING SYSTEM USING HONEYCOMB PAPERBOARD

被引:2
作者
Lv, Yuan-Jun [1 ]
Chen, Qiong [1 ]
机构
[1] Zhejiang Ind Polytech Coll, Mech & Elect Engn, Shaoxing 312000, Peoples R China
关键词
Free drop impact; honeycomb paperboard; strain energy; peak acceleration;
D O I
10.1142/S0219686711002119
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A packaging system using the material of honeycomb paperboard, when it is subjected to drop impact, is a major concern to manufacturers as it relates to the maximum stress causing failure. In this work, the full-field dynamic responses of product packaging system are measured and analyzed in detail with the simulation and experiment method. First, on the basis of theoretical analysis, a series of honeycomb paperboards with different size dimension of paper honeycomb core had been set up in the FEA software. Then a packaging system which is made up of rigid body and deformable body had been analyzed. The results show that the physical dimension of paper honeycomb core has a great effect on its impact resistance: with the increasing size dimension, the peak acceleration has a quickly alteration within 10mm-20mm, but in other region it has an effect in the form of up and down fluctuation. At the same time, with the increasing size dimension, honeycomb paperboard can improve the energy absorption ability in the condition of elastic deformation. The research results can be used to optimize the structure design and material selection.
引用
收藏
页码:167 / 174
页数:8
相关论文
共 15 条
[1]   Drop impact reliability testing for lead-free and lead-based soldered IC packages [J].
Chong, Desmond Y. R. ;
Che, F. X. ;
Pang, John H. L. ;
Ng, Kellin ;
Tan, Jane Y. N. ;
Low, Patrick T. H. .
MICROELECTRONICS RELIABILITY, 2006, 46 (07) :1160-1171
[2]   Effects of different drop test conditions on board-level reliability of chip-scale packages [J].
Lai, Yi-Shao ;
Yang, Po-Chuan ;
Yeh, Chang-Lin .
MICROELECTRONICS RELIABILITY, 2008, 48 (02) :274-281
[3]   Investigations of board-level drop reliability of wafer-level chip-scale packages [J].
Lai, Yi-Shao ;
Yeh, Chang-Lin ;
Wang, Ching-Chun .
JOURNAL OF ELECTRONIC PACKAGING, 2007, 129 (01) :105-108
[4]  
Li X.-L., 2004, J SHAANXI U SCI TEC, V22, P74
[5]   Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact [J].
Liu, Fang ;
Meng, Guang ;
Zhao, Mei ;
Zhao, Jun feng .
MICROELECTRONICS RELIABILITY, 2009, 49 (01) :79-85
[6]   Initial global-local analysis for drop-impact effect study of TV products [J].
Low, KH ;
Wang, YQ ;
Hoon, KH ;
Vahdati, N .
ADVANCES IN ENGINEERING SOFTWARE, 2004, 35 (3-4) :179-190
[7]   Finite element analysis (FEA) applied to polyethylene foam cushions in package drop tests [J].
Mills, NJ ;
Masso-Moreu, Y .
PACKAGING TECHNOLOGY AND SCIENCE, 2005, 18 (01) :29-38
[8]  
Park S, 2007, ELEC COMP C, P914
[9]  
TOLENO B, 2007, P 2007 SMTA PAN PAC
[10]   Energy Absorption Diagrams of Paper Honeycomb Sandwich Structures [J].
Wang, Dong-Mei ;
Wang, Zhi-Wei ;
Liao, Qiang-Hua .
PACKAGING TECHNOLOGY AND SCIENCE, 2009, 22 (02) :63-67