Injection-compression molding was used for film insert molding of an automotive door grip using films with three-dimensional embossed patterns. A vacuum mold was fabricated for vacuum-assisted thermoforming of the film, and an injection-compression mold was developed for film insert molding. Three pressure transducers were installed inside the mold cavity to measure cavity pressures. Injection-compression molding experiments under various compression strokes and toggle speeds were performed to investigate their effects on the cavity pressure and heights of the embossed patterns. The compression stroke of 0.9mm and low toggle speed resulted in a higher degree of conservation of embossed patterns. Additionally, the processing conditions for the maximum heights of embossed patterns were almost similar to those for minimum integral value of cavity pressures. The injection-compression molding process presents the opportunity to impart a soft-touch feeling of plastic parts printed with embossed patterns.
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Seoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South KoreaSeoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South Korea
Kim, Seong Yun
Oh, Hwa Jin
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Seoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South KoreaSeoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South Korea
Oh, Hwa Jin
Kim, Sung Ho
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Seoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South KoreaSeoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South Korea
Kim, Sung Ho
Kim, Chae Hwan
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Seoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South KoreaSeoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South Korea
Kim, Chae Hwan
Lee, Seung Hwan
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Seoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South KoreaSeoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South Korea
Lee, Seung Hwan
Youn, Jae Ryoun
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Seoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South KoreaSeoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South Korea
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Seoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South KoreaSeoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South Korea
Kim, Seong Yun
Oh, Hwa Jin
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Seoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South KoreaSeoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South Korea
Oh, Hwa Jin
Kim, Sung Ho
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Seoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South KoreaSeoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South Korea
Kim, Sung Ho
Kim, Chae Hwan
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Seoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South KoreaSeoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South Korea
Kim, Chae Hwan
Lee, Seung Hwan
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Seoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South KoreaSeoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South Korea
Lee, Seung Hwan
Youn, Jae Ryoun
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Seoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South KoreaSeoul Natl Univ, Dept Mat Sci & Engn, Res Inst Adv Mat, Seoul, South Korea