PREPARATION OF NI-SN ALLOYS BY AN ELECTROLESS-DEPOSITION METHOD

被引：17

作者：

SHIMAUCHI, H ^{[1
]}

OZAWA, S ^{[1
]}

TAMURA, K ^{[1
]}

OSAKA, T ^{[1
]}

机构：

[1] WASEDA UNIV,KAGAMI MEM LAB MAT SCI,SHINJUKU KU,TOKYO 169,JAPAN

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1994年 / 141卷 / 06期

关键词：

Composition effects - Corrosion resistance - Crystal structure - Electrodeposition - Metallic films - Nickel alloys - Soldering - Tin alloys;

D O I：

10.1149/1.2054948

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Electroless-deposited Ni-Sn alloy films were investigated to increase tin content in the deposit. The maximum tin contents of electroless Ni-Sn-P and Ni-Sn-B were ca. 30 atom percent (a/o) and 42 a/o, respectively. The maximum tin content in the case of Ni-Sn-B was nearly equal to that of electrodeposited Ni-Sn alloy already reported. The crystallinity of Ni-Sn-P and Ni-Sn-B alloys was raised up with an increase in tin content. The corrosion resistance of Ni-Sn-P and Ni-Sn-B alloys was between that of amorphous and crystalline electroless-deposited Ni-P. Codeposition of tin into Ni-P films improved solderability, but into the Ni-B films, the solderability of Ni-Sn-B films situated in the region between those of Ni-P and NiB, because the solderability of NiB is higher.

引用

页码：1471 / 1476

页数：6

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