LOW-TEMPERATURE TEMPERING-INDUCED CHANGES IN BULK RESISTIVITY, TEMPERATURE-COEFFICIENT OF RESISTIVITY AND STRESS IN PHYSICALLY VAPOR-DEPOSITED TIN

被引：24
作者：
ERNSBERGER, C
PERRY, AJ
LEHMAN, LP
MILLER, AE
PELTON, AR
DABROWSKI, BW
机构：
[1] CTS CORP, 905 W BLVD N, ELKHART, IN 46514 USA
[2] GTE VALENITE CORP, TROY, MI 48084 USA
[3] UNIV NOTRE DAME, NOTRE DAME, IN 46556 USA
来源：
SURFACE & COATINGS TECHNOLOGY | 1988年 / 36卷 / 3-4期
关键词：
The authors gratefully acknowledge the continuing support of CTS Corporation and the Indiana Corporation for Science and Technology. A.R.P. and B.D.W. additionally acknowledge the support of the Jesse H. Jones Foundation. We appreciate the efforts of Tom Smith; Sarah Leach; Don Banks; Mark Jagner and Tish Wasulko who obtained much of the data utilized in this study as well as helped in the preparation of the manuscript. Helpful discussions were had with Dr. Robert Buschert and Dr. Karl Heirich at Goshen College;
D O I：
10.1016/0257-8972(88)90003-5
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
19
引用
收藏
页码：605 / 616
页数：12
相关论文
共 19 条
[1]   THE STRESS IN ION-PLATED HFN AND TIN COATINGS [J].
CHOLLET, L ;
PERRY, AJ .
THIN SOLID FILMS, 1985, 123 (03) :223-234
[2]   LOW-TEMPERATURE OXIDATION BEHAVIOR OF REACTIVELY SPUTTERED TIN BY X-RAY PHOTOELECTRON-SPECTROSCOPY AND CONTACT RESISTANCE MEASUREMENTS [J].
ERNSBERGER, C ;
NICKERSON, J ;
SMITH, T .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (06) :2784-2788
[3]   EFFECTS OF SUBSTRATE-TEMPERATURE AND SUBSTRATE MATERIAL ON THE STRUCTURE OF REACTIVELY SPUTTERED TIN FILMS [J].
HIBBS, MK ;
JOHANSSON, BO ;
SUNDGREN, JE ;
HELMERSSON, U .
THIN SOLID FILMS, 1984, 122 (02) :115-129
[4]   ELECTRON-MICROSCOPY STUDY OF SPUTTERED NBN FILMS [J].
HO, HL ;
KAMPWIRTH, RT ;
GRAY, KE ;
CAPONE, DW ;
CHUMBLEY, LS ;
MESHII, M .
ULTRAMICROSCOPY, 1987, 22 (1-4) :297-303
[5]  
HU CK, 1985, RC11139 PREPR
[6]   GROWTH AND PROPERTIES OF SINGLE-CRYSTAL TIN FILMS DEPOSITED BY REACTIVE MAGNETRON SPUTTERING [J].
JOHANSSON, BO ;
SUNDGREN, JE ;
GREENE, JE ;
ROCKETT, A ;
BARNETT, SA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (02) :303-307
[7]   BIAS-INDUCED STRESS TRANSITIONS IN SPUTTERED TIN FILMS [J].
KATTELUS, HP ;
TANDON, JL ;
SALA, C ;
NICOLET, MA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (04) :1850-1854
[8]  
Noyan I. C., 1987, RESIDUAL STRESS MEAS, P117
[9]  
PELTON AR, IN PRESS ULTRAMICROS
[10]   THE CHEMICAL-ANALYSIS OF TIN FILMS - A ROUND-ROBIN EXPERIMENT [J].
PERRY, AJ ;
STRANDBERG, C ;
SPROUL, WD ;
HOFMANN, S ;
ERNSBERGER, C ;
NICKERSON, J ;
CHOLLET, L .
THIN SOLID FILMS, 1987, 153 :169-183
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