RIE PLANARIZATION PROCESS FOR MAGNETIC-BUBBLE DEVICES

被引：0

作者：

CHI, GC

MOGAB, CJ

机构：

来源：

IEEE TRANSACTIONS ON MAGNETICS | 1985年 / 21卷 / 02期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：1170 / 1173

页数：4

共 13 条

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[8] 300 KBIT BUBBLE MEMORY CHIP WITH PLANAR STRUCTURE [J].

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[9] EFFECT OF CONDUCTOR CROSSINGS ON PROPAGATION MARGINS [J].

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