ELECTRO-MIGRATION ON PAPER IN THE SEPARATION OF IONS .4.

被引:1
作者
MUKERJEE, HG
机构
来源
FRESENIUS ZEITSCHRIFT FUR ANALYTISCHE CHEMIE | 1957年 / 156卷 / 03期
关键词
D O I
10.1007/BF00447668
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
引用
收藏
页码:184 / 189
页数:6
相关论文
共 50 条
[21]   Optimization of via contact test structure for electro-migration [J].
Yamamoto, S ;
Komori, J ;
Takata, Y ;
Sekine, M ;
Koyama, H .
1997 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES - PROCEEDINGS, 1997, :67-71
[22]   ELECTRO-MIGRATION OF GRAIN-BOUNDARY IN PURE NIOBIUM [J].
IONOV, AM ;
KOPETSKII, CV ;
FIONOVA, LK .
FIZIKA METALLOV I METALLOVEDENIE, 1976, 42 (04) :710-715
[23]   Research and Verification of Electro-migration PoF Models in Integrated Circuit [J].
Lu Fengming ;
Shao Jiang ;
Zhang Ming .
2017 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE (PHM-HARBIN), 2017, :1244-1248
[24]   Study of electro-migration and capture of particles by a charged pendant droplet [J].
Biswal, Debabrat ;
Ray, Bahni ;
Dasgupta, Debabrata ;
Thaokar, Rochish M. ;
Mayya, Y. S. .
JOURNAL OF AEROSOL SCIENCE, 2024, 177
[25]   Heat-Associated Field Distortion in Electro-Migration Techniques [J].
Evenhuis, Christopher J. ;
Musheev, Michael U. ;
Krylov, Sergey N. .
ANALYTICAL CHEMISTRY, 2010, 82 (20) :8398-8401
[26]   Model Based Method for Electro-Migration Stress Determination in Interconnects [J].
Demircan, Ertugrul ;
Shroff, Mehul .
2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2014,
[27]   Electro-migration of silver alloy wire with its application on bonding [J].
Wang, Shenggang ;
Gao, Liming ;
Li, Ming ;
Huang, Dacheng ;
Qian, Ken ;
Chiu, Hope .
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, :789-+
[28]   Electro-migration Behavior in Low Temperature Flip Chip Bonding [J].
Murayama, Kei ;
Higashi, Mitsutoshi ;
Sakai, Taiji ;
Imaizumi, Nobuaki .
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, :608-614
[29]   Cu Via Process Optimization by Electro-migration Estimation Testing [J].
Chen, Yi Heng ;
Sung, Hui-Lan ;
Lo, Shao-Jui .
PROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015), 2015, :48-51
[30]   Influence of micro voids in flip chip bump on electro-migration reliability [J].
Murayama, Kei ;
Lee, Kor Oon ;
Ono, Toshiaki ;
Oi, Kiyoshi ;
Lim, Sze Pei ;
Yeo, Yvonne ;
Sweatman, Keith ;
Martell, Steven R. ;
Shimamoto, Haruo ;
Tsuriya, Masahiro .
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, :1144-1152