Plastic reshaping of silicon microstructures: Process, characterization and application

被引：3

作者：

Gärtner E. ^{[1
]}

Frühauf J. ^{[1
]}

Jänsch E. ^{[1
]}

机构：

[1] Dept. Elec. Eng. and Info. Technol., Technical University of Chemnitz

来源：

Microsystem Technologies | 2001年 / 7卷 / 4期

关键词：

Silicon; Microstructure; Furnace; Plastic Deformation; Fracture Strength;

D O I：

10.1007/s005420000078

中图分类号：

学科分类号：

摘要：

The plastic reshaping is applied to Si microstructures prepared by wet anisotropic etching. The performed processes are the deformation in a furnace with tools also prepared from Si and the laser beaming. The generation of dislocations necessary for the plastic deformation of the monocrystalline dislocation free material and the bending fracture strength of undeformed and deformed Si are investigated. Demonstrators for possible applications are presented.

引用

页码：155 / 160

页数：5

共 18 条

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