Lead-free solders in IC manufacture: A review

被引：10

作者：

V. V. Zenin

V. N. Belyaev

Yu. E. Segal

A. A. Kolbenkov

机构：

[1] Voronezh State Technical University, Voronezh

[2] Elektronika Engineering Consultancy, Voronezh

[3] OAO Voronezh Semiconduct.-D.F.P., Voronezh

来源：

Russian Microelectronics | 2003年 / 32卷 / 4期

关键词：

Gold; Indium; Microwave; Melting Point; Solid State;

D O I：

10.1023/A:1024579616706

中图分类号：

学科分类号：

摘要：

The compositions and melting points of lead-free solders suitable for IC packaging are given. The use of tin-bismuth alloys for both this purpose and the corrosion protection of packages is outlined. An investigation is described into the dissolution of 0.04-mm-thick gold wire in the POIn50 tin-indium solder in the molten or solid state. In the former case the process is examined as a function of solder temperature and the contact time between the molten solder and the wire. In the latter case, dissolution kinetics is studied at 100°C. The soldering of gold-coated hybrid-IC substrates, including microwave ones, to metal bases is addressed. In this context an analysis of the interaction between the POIn50 solder and the gold coating is presented.

引用

页码：247 / 256

页数：9

共 21 条

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