One-step continuous coating of silver nanoparticles on well aligned fibers of PAI/PTACM

被引:0
作者
Bharat Bajaj
Bin Kim
Sangjun Yoon
Jaerock Lee
Byungki Park
机构
[1] Korea Research Institute of Chemical Technology,Energy Materials Research Center
[2] University of Science and Technology (UST),Nanomaterials Science and Engineering
[3] Korea Institute of Science and Technology,Carbon Convergence Material Research Center
来源
Fibers and Polymers | 2014年 / 15卷
关键词
Poly (amide-imide); Poly (trimellitic anhydride chloride-co-4; 4′-methylene dianiline); Mechano-electrospinning; Electroless silver plating; Polyethylene glycol; Silver nanoparticles;
D O I
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中图分类号
学科分类号
摘要
Highly aligned ultrafine fibers of Poly (amide-co-imide) PAI (torlon)/Poly (trimellitic anhydride chloride-co-4, 4′-methylene dianiline) (PTACM) blends have been prepared by using mechano-electrospinning. Employing a mixed solvent system of DMSO and THF alongwith water coagulation bath as a medium, continuous fibers with improved mechanical properties have been obtained. The continuity of the fibers is strongly dependent on the solvent mixing ratio of DMSO and THF (6:4). Continuous fibers with the most uniform diameter are obtained when a 30 % of PAI and PTACM (1:1) resins by weight is used in the blending solution. The aligned fibers are further coated with silver nanoparticles using a one-step process by passing the electrospunned fibers through PEG solution and a silver precursor solution followed by reduction in a continuous process. The advantage of our method lies in a uniform silver coating on a single fiber that can be coated continuously on a larger length scale (∼Km). The mechanical properties of these fibers are dramatically improved after their alignment. Better electrical conductivity is obtained for these fibers after they are coated with silver nanoparticles. The highly aligned silver decorated fibers utilizes a novel electroless continuous process using Polyethylene glycol (PEG), which shows good binding properties and can be used for various bio and electronic applications.
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页码:47 / 56
页数:9
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