共 77 条
- [1] Gan CL(2015)Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years J Mater Sci-Mater Electron 26 4412-4424
- [2] Hashim U(2016)Reliability based design optimization of wire bonding in power microelectronic devices Microsyst Technol-Micro-Nanosyst-Inf Storage Process Syst 22 2737-2748
- [3] Makhloufi A(2017)Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation Crystals 7 10-2434
- [4] Aoues Y(2013)Copper Wire Bonding Concerns and Best Practices J Elec Mater 42 2415-522
- [5] El Hami A(2020)Overlap joining of aluminium and copper using laser micro welding with spatial power modulation Weld World 64 513-1098
- [6] Tada N(2012)Challenges and developments of copper wire bonding technology Microelectron Reliab 52 1092-623
- [7] Tanaka T(2011)Effect of ultrasonic energy on nanoscale interfacial structure in copper wire bonding on aluminium pads J Phys D-Appl Phys 44 5-12
- [8] Uemori T(2007)Fundamentals of thermo-sonic copper wire bonding in microelectronics packaging J Mater Sci 42 615-268
- [9] Nakata T(2011)Overview of wire bonding using copper wire or insulated wire Microelectron Reliab 51 4-82
- [10] Chauhan P(2014)Stitch bond strength study in insulated Cu wire bonding Mater Res Innov 18 264-186