Effect of welding parameters on resistance thermocompression microwelded joint of insulated copper wire

被引:0
作者
Zhiyuan Cui
Yuanbo Li
Lingyu Chen
Songjie Wen
Songming Guo
机构
[1] Guangdong University of Technology,Guangzhou Key Laboratory of Nontraditional Machining and Equipment
[2] Guangdong University of Technology,State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment
来源
Welding in the World | 2021年 / 65卷
关键词
Insulated copper wire; Resistance thermocompression microwelding; Fracture mode; Solid-state bonding; Multi-factor orthogonal experiment;
D O I
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中图分类号
学科分类号
摘要
Insulated copper wire has been widely used in many industries, but the insulating coating must be removed before welding because it will hinder the formation of joints. Therefore, in this work, the resistance thermocompression microwelding process for insulated wire without removing the coating in advance was proposed. Through detailed mechanical testing and metallurgical examination, the effects of welding voltage on the joint appearance, joint macro-/microstructure, joint breaking force, and joint fracture mode were investigated. The results showed that joints were achieved by solid-state bonding. As the welding voltage was further increased, the joint breaking force increased first and then decreased. Corresponding to the change of the welding voltage, the fracture mode of the joints changed from interfacial fracture to partial pullout fracture. The fracture position also moved backwards gradually, which was caused by the expansion of the bonding area, the improvement of the interfacial strength, and the amount of heat input. Finally, an orthogonal experiment was conducted to investigate the significance level of three parameters. Under the optimal for joint breaking force parameters (2.1 V, 24 ms, and 12 N), the average achievable force was 1.1723 N, which was about 83.7% of the breaking force of the as-received wire.
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页码:909 / 920
页数:11
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