Embossing of 3D ceramic microstructures

被引：0
|
作者：
B. Su
T. W. Button
A. Schneider
L. Singleton
P. Prewett
机构：
[1] IRC in Materials Processing,
[2] University of Birmingham,undefined
[3] Edgbaston,undefined
[4] Birmingham B15 2TT,undefined
[5] UK E-mail: B.SU@bham.ac.uk,undefined
[6] Central Microstructure Facility,undefined
[7] Rutherford Appleton Laboratory,undefined
[8] Chilton,undefined
[9] Oxfordshire OX11 0QX,undefined
[10] UK,undefined
[11] Institut für Mikrotechnik Mainz GmbH,undefined
[12] Carl-Zeiss-Str. 18–20,undefined
[13] D-55129 Mainz,undefined
[14] Germany,undefined
[15] School of Manufacturing and Mechanical Engineering,undefined
[16] University of Birmingham,undefined
[17] UK,undefined
来源：
Microsystem Technologies | 2002年 / 8卷
关键词：
Polymer; Microstructure; Zirconate; Titanate; Aspect Ratio;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
 An embossing method based on the viscous polymer processed (VPP) ceramic tape has been used to fabricate 3D ceramic microstructures with high aspect ratios. Examples of lead zirconate titanate (PZT) microrod arrays with feature sizes of 10–150 μm and aspect ratios of 3–10 have been demonstrated. Advantages of the embossing technique over conventional casting and moulding methods are discussed.
引用
收藏
页码：359 / 362
页数：3
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