Fundamental aspects of film formation in electrochemical polishing of silver and silver-copper alloys in thiosulfate solutions

被引：0
作者：
E. P. Grishina
S. I. Galanin
O. A. Ivanova
机构：
[1] Russian Academy of Sciences,Institute of Chemistry of Solutions
[2] Kostroma State Technological University,undefined
来源：
Russian Journal of Applied Chemistry | 2004年 / 77卷
关键词：
Copper; Cycling Voltammetry; Thiosulfate; Film Formation; Fundamental Aspect;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The anodic behavior of silver and its alloys with copper in thiosulfate solutions was studied by cycling voltammetry. A scheme of an electrochemical polishing process including the stage of formation of a resistive layer of silver thiosulfate and the chemical stage of its dissolution is suggested.
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页码：1283 / 1286
页数：3
相关论文
共 22 条
[1]  
Cabane-Brouty F.(1964)undefined Metaux (Corros.-Inds.) 39 343-345
[2]  
Ruze B.(1960)undefined Zh. Prikl. Khim. 33 469-471
[3]  
Nukulin V.N.(2001)undefined Elektrokhimiya 37 474-478
[4]  
Tsypin M.Z.(2003)undefined Izv. Vyssh. Uchebn. Zaved., Khim. Khim. Tekhnol. 46 104-107
[5]  
Grishina E.P.(2003)undefined Zh. Fiz. Khim. 77 2081-2083
[6]  
Rumyantsev E.M.(2001)undefined Zh. Prikl. Khim. 74 1633-1635
[7]  
Grishina E.P.(1974)undefined Electrochim. Acta 19 901-905
[8]  
Noskov A.V.(2003)undefined Elektrokhimiya 39 1003-1007
[9]  
Noskov A.V.(undefined)undefined undefined undefined undefined-undefined
[10]  
Balmasov A.V.(undefined)undefined undefined undefined undefined-undefined
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