A novel, organic, UV-sensitive resist ideal for nanoimprint-, photo- and laser lithography in an air atmosphere

A UV-sensitive resist capable of curing in an oxygen atmosphere using single wavelength LED light sources is a niche area many UVnanoimprint lithography resists are incapable of addressing. However, the novel negative tone resist, presently (2015) known as DELOKATIOBOND OM VE 110707 (Delo-Katiobond), from Delo Industrial Adhesives has been designed to be specifically compatible with such conditions within the 320–440 nm wavelength range. The authors acquired some of the resist and evaluated its photolithographic performance under such conditions. Several lithographic methods were evaluated, namely nanoimprint-, photo- and laser lithography. Under the step-and-flash nanoimprint test conditions the Delo-Katiobond outperformed commercial alternatives from AMO and Microresist Technology. Processing and development conditions for photo- and laser lithography are also presented. Different discrete wavelengths were used for curing the resist in these two separate lithography processes, 365 nm and 405 nm respectively. The laser-defined lines in Delo-Katiobond coatings were found to be a fraction of alternative resist Nano SU-8 from MicroChem. The functionality of the Delo-Katiobond resist is also evaluated here. It is demonstrated to be effective for a range of resist functions including metal lift-off, elastomeric polymer casting and as a mask for reactive ion etching of a variety of materials. [graphic not available: see fulltext]