共 80 条
[1]
Geffroy PM(2008)Heat sink material selection in electronic devices by computational approach Adv Eng Mater 10 400-405
[2]
Matthias JD(2014)Thermal expansion coefficient and thermal fatigue of discontinuous carbon fiber-reinforced copper and aluminium matrix composites without interfacial chemical bond J Mater Sci 49 397-402
[3]
Silvain JF(2009)Novel processing and characterization of Cu/CNF nanocomposite for high thermal conductivity applications Compos Sci Technol 69 2474-2484
[4]
Lalet G(2006)Development of novel carbon nanotube reinforced magnesium nanocomposites using the powder metallurgy technique Nanotechnology 17 7-12
[5]
Kurita H(2008)Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications Mater Sci Eng A 475 39-44
[6]
Heintz J-M(2010)Thermal conductivity of SPS consolidates Cu/diamond composites with Cr-coated diamond particles J Alloy Compd 490 453-458
[7]
Lacombe G(2007)On the influence of active element content on the thermal conductivity and thermal expansion of Cu–X (X = Cr, B) diamond composites Scripta Mater 57 988-991
[8]
Kawasaki A(2011)Effect of coating on the microstructure and thermal conductivities of diamond–Cu composites prepared by powder metallurgy Compos Sci Technol 71 1550-1555
[9]
Silvain J-F(2012)Influence of the interface structure on the thermo-mechanical properties of Cu–X (X = Cr or B)/Carbon fiber composites Mater Res Bull 47 375-380
[10]
Silvain JF(1992)Thermal decomposition of Ca(OH) J Mater Sci Lett 11 1708-1710