Novel electrical characterization for advanced CMOS gate dielectrics

被引:0
作者
T. P. Ma
机构
[1] Yale University,Department of Electrical Engineering
来源
Science in China Series F: Information Sciences | 2008年 / 51卷
关键词
MOS device; gate dielectrics; electrical characterization; IETS; PASHEI;
D O I
暂无
中图分类号
学科分类号
摘要
This paper reviews the following electrical characterization techniques for measuring the microscopic bonding structures, impurities, and electrically active defects in advanced CMOS gate stacks: 1) inelastic electron tunneling spectroscopy (IETS), 2) lateral profiling of threshold voltages, interface-trap density, and oxide charge density distributions along the channel of an MOSFET, and 3) pulse agitated substrate hot electron injection (PASHEI) technique for measuring trapping effects in the gate dielectric at low and modest gate voltages.
引用
收藏
页码:774 / 779
页数:5
相关论文
共 50 条
[41]   Electrical Properties of Radio-Frequency Sputtered HfO2 Thin Films for Advanced CMOS Technology [J].
Sarkar, Pranab Kumar ;
Roy, Asim .
ADVANCED MATERIALS AND RADIATION PHYSICS (AMRP-2015), 2015, 1675
[42]   La2O3 gate dielectrics for AlGaN/GaN HEMT [J].
Chen, J. ;
Kawanago, T. ;
Wakabayashi, H. ;
Tsutsui, K. ;
Iwai, H. ;
Nohata, D. ;
Nohira, H. ;
Kakushima, K. .
MICROELECTRONICS RELIABILITY, 2016, 60 :16-19
[43]   Recent Advances in Polymer Gate Dielectrics for Organic Thin-Film Transistors [J].
Li, Lu ;
Liu, Shaoxiong ;
Wang, Kaifeng ;
Wu, Bo ;
Zhang, Shiming .
MACROMOLECULAR CHEMISTRY AND PHYSICS, 2025, 226 (11)
[44]   Recent Advances in Gate Dielectrics for Enhanced Leakage Current Management and Device Performance [J].
Jeong, Yeojin ;
Cho, Jaewoong ;
Pham, Duy Phong ;
Yi, Junsin .
TRANSACTIONS ON ELECTRICAL AND ELECTRONIC MATERIALS, 2024, 25 (04) :380-392
[45]   Nano gate dielectrics for low voltage operation of organic thin film transistors [J].
Kim, Kang Dae ;
Kim, Dong Soo ;
Kim, Chung Kyun ;
Song, Chung Kun .
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2008, 47 (8 PART 1) :6496-6501
[46]   Novel fabrication process to realize ultra-thin (EOT=0.7nm) and ultra-low leakage SiON gate dielectrics [J].
Matsushita, D ;
Muraoka, K ;
Nakasaki, Y ;
Kato, K ;
Inumiya, S ;
Eguchi, K ;
Takayanagi, M .
2004 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2004, :172-173
[47]   MBE lanthanum-based high-k gate dielectrics as candidates for SiO2 gate oxide replacement [J].
Vellianitis, G ;
Apostolopoulos, G ;
Mavrou, G ;
Argyropoulos, K ;
Dimoulas, A ;
Hooker, JC ;
Conard, T ;
Butcher, M .
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2004, 109 (1-3) :85-88
[48]   Influences of structure around gate-edge on high electric field strength in MISFETs with high-k gate dielectrics [J].
Ono, M ;
Nishiyama, A .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2004, 51 (01) :68-73
[49]   Extraction of parameters of high permittivity ultrathin (0.5-2.0 nm) gate dielectrics [J].
Kar, S .
2004 INTERNATIONAL SEMICONDUCTOR CONFERENCE, VOLS 1AND 2, PROCEEDINGS, 2004, :341-344
[50]   Review and Perspective of Hf-based High-k Gate Dielectrics on Silicon [J].
He, Gang ;
Sun, Zhaoqi ;
Li, Guang ;
Zhang, Lide .
CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES, 2012, 37 (03) :131-157