The structure of the Si (211) surface

被引:0
作者
C. Fulk
S. Sivananthan
D. Zavitz
R. Singh
M. Trenary
Y. P. Chen
G. Brill
N. Dhar
机构
[1] EPIR Technologies Inc.,Department of Physics
[2] University of Illinois at Chicago,Department of Chemistry
[3] University of Illinois at Chicago,undefined
[4] U.S. Army Research Laboratory,undefined
来源
Journal of Electronic Materials | 2006年 / 35卷
关键词
Reconstruction; Si (211); LEED; STM;
D O I
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中图分类号
学科分类号
摘要
Silicon (211) has been proposed as an alternative substrate for CdTe/HgCdTe molecular beam epitaxial growth. Silicon has a clear advantage over other substrates because of its low cost, high strength, and thermal-expansion coefficient, which matches that of the silicon readout integrated circuit. The (211) orientation has been shown to yield high-quality CdTe and HgCdTe/CdTe layers over other orientations. The reconstruction and faceting of the Si (211) surface is poorly understood despite the importance of the (211) orientation. The results of low-energy electron diffraction (LEED) studies have been contradictory, and their conclusions are inconsistent with recent scanning tunneling microscopy (STM) studies. LEED and STM images were used to determine the most probable Si (211) surface facet structure as a function of annealing temperature. Samples annealed at a high temperature (i.e., >1260°C) allowed the formation of ordered LEED spot patterns as opposed to the typically reported \documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document} $$[\bar 111]$$ \end{document} streaks. The pattern in the \documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document} $$[0\bar 11]$$ \end{document} direction gave a consistent 2× (7.68 Å) reconstruction.
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页码:1449 / 1454
页数:5
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