Emf Measurements in the Liquid Au-Cu-Sn Lead-free Solder Alloys

被引：0
|
作者：
A. Wierzbicka-Miernik
G. Garzel
L. A. Zabdyr
机构：
[1] Institute of Metallurgy and Materials Science,
[2] Polish Academy of Sciences,undefined
来源：
Journal of Phase Equilibria and Diffusion | 2010年 / 31卷
关键词：
emf method; lead-free solders; thermodynamic properties;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
An emf method was employed to determine tin activities in the liquid Au-Cu-Sn alloys using solid electrolyte galvanic cells. The whole concentration range of the Gibbs triangle was covered, and emf readings were taken for both heating and cooling mode within temperature interval: 900-1360 K. Emf versus T relations were approximated by line equations, and its coefficients were listed in tables. Tin activity versus composition curves were constructed, displaying negative deviation from ideal behavior. Activity data were compared to the respective values calculated from COST 531 database using binary formalism, and relatively good agreement was observed.
引用
收藏
页码：34 / 36
页数：2
相关论文
共 50 条
  • [21] Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys
    John W. Elmer
    Eliot D. Specht
    Mukul Kumar
    Journal of Electronic Materials, 2010, 39 : 273 - 282
  • [22] Electromotive force measurements in liquid Ag-In-Pd lead-free alloys
    Garzet, Grzegorz
    Zabdyr, Leszek A.
    RARE METALS, 2006, 25 (05) : 587 - 591
  • [23] Electromotive force measurements in liquid Ag-In-Pd lead-free alloys
    Grzegorz Garzet
    Leszek A.Zabdyr
    RareMetals, 2006, (05) : 587 - 591
  • [24] Enthalpies of mixing of liquid Bi-Cu and Bi-Cu-Sn alloys relevant for lead-free soldering
    Flandorfer, Hans
    Sabbar, Abdelaziz
    Luef, Christoph
    Rechchach, Meryem
    Ipser, Herbert
    THERMOCHIMICA ACTA, 2008, 472 (1-2) : 1 - 10
  • [25] A Replaceable Lead-free Solder For Sn-37Pb
    Li, Yuanshan
    Chen, Xu
    Luo, Yufeng
    INFORMATION ENGINEERING FOR MECHANICS AND MATERIALS SCIENCE, PTS 1 AND 2, 2011, 80-81 : 108 - 112
  • [26] Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates
    Amore, S.
    Ricci, E.
    Borzone, G.
    Novakovic, R.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2008, 495 (1-2): : 108 - 112
  • [27] Second generation lead-free solder alloys - A challenge to thermodynamics
    Plumbridge, WJ
    MONATSHEFTE FUR CHEMIE, 2005, 136 (11): : 1811 - 1821
  • [28] Effect of additives on the co-electrodeposition of Sn-Ag-Cu lead-free solder composition
    Joseph, Shany
    Phatak, Girish J.
    MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, 2010, 168 (1-3): : 219 - 223
  • [29] Morphology Variations of Primary Cu6Sn5 Intermetallics in Lead-Free Solder Balls
    Mueller, Maik
    Panchenko, Iuliana
    Wiese, Steffen
    Wolter, Klaus-Juergen
    2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2018,
  • [30] Measurement of Mixing Enthalpies for Sn-Bi-Sb Lead-Free Solder System
    Singh, Vikrant
    Pathote, Dileep
    Jaiswal, Dheeraj
    Kumar, M. R.
    Singh, Kamalesh K.
    Behera, C. K.
    JOURNAL OF ELECTRONIC MATERIALS, 2023, 52 (09) : 6316 - 6334
12345