Boosted high-temperature electrical characteristics of AlGaN/GaN HEMTs with rationally designed compositionally graded AlGaN back barriers

被引:22
作者
Zhang, Haochen [1 ]
Sun, Yue [1 ]
Hu, Kunpeng [1 ]
Yang, Lei [1 ]
Liang, Kun [1 ]
Xing, Zhanyong [1 ]
Wang, Hu [1 ]
Zhang, Mingshuo [1 ]
Yu, Huabin [1 ]
Fang, Shi [1 ]
Kang, Yang [1 ]
Sun, Haiding [1 ]
机构
[1] Univ Sci & Technol China, Sch Microelect, Hefei 230026, Peoples R China
基金
中国国家自然科学基金;
关键词
AlGaN; GaN HEMT; graded AlGaN back barrier; SiNx passivation; DHHEMT; high temperature stability; LEAKAGE CURRENT; IMPACT;
D O I
10.1007/s11432-022-3694-4
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Wide bandgap GaN-based HEMTs have shown great potential as key components in various power electronic systems but still face challenges in the pursuit of devices with stable operation capability especially in harsh environments. Here, we report a high-performance double heterojunction (DH) based AlGaN/GaN HEMT by incorporating a decreasing-Al-composition (DAC) graded AlGaN back barrier (BB) beneath the GaN channel. Thanks to the improved electron confinement enabled by graded BB, the DHHEMT exhibits significantly improved on-state drain current density and off-state breakdown voltage compared with a single heterojunction (SH) based HEMT. More intriguingly, with an additional SiNx passivation layer, the surface states of the DH-HEMTs can be effectively suppressed, leading to an almost constant off-state leakage current and negligible gate contact degradation across the temperature range from 25 & DEG; C to 150 & DEG; C. These results highlight the superiority and reliability of the proposed graded AlGaN BB to boost device characteristics for applications under high temperatures and harsh conditions.
引用
收藏
页数:9
相关论文
共 37 条
[21]   Multi-channel nanowire devices for efficient power conversion [J].
Nela, L. ;
Ma, J. ;
Erine, C. ;
Xiang, P. ;
Shen, T. -H. ;
Tileli, V. ;
Wang, T. ;
Cheng, K. ;
Matioli, E. .
NATURE ELECTRONICS, 2021, 4 (04) :284-+
[22]   A perspective on multi-channel technology for the next-generation of GaN power devices [J].
Nela, Luca ;
Xiao, Ming ;
Zhang, Yuhao ;
Matioli, Elison .
APPLIED PHYSICS LETTERS, 2022, 120 (19)
[23]   Steep Subthreshold Swing in GaN Negative Capacitance Field-Effect Transistors [J].
Song, Wenjing ;
Li, Yi ;
Zhang, Kai ;
Zou, Xuming ;
Wang, Jingli ;
Kong, Yuechan ;
Chen, Tangsheng ;
Jiang, Changzhong ;
Liu, Chuansheng ;
Liao, Lei ;
Liu, Xingqiang .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 66 (10) :4148-4150
[24]   Correlation Between Electrical Performance and Gate Width of GaN-Based HEMTs [J].
Sun, Yue ;
Zhang, Haochen ;
Yang, Lei ;
Hu, Kunpeng ;
Xing, Zhanyong ;
Liang, Kun ;
Yu, Huabin ;
Fang, Shi ;
Kang, Yang ;
Wang, Danhao ;
Xu, Guangwei ;
Sun, Haiding ;
Long, Shibing .
IEEE ELECTRON DEVICE LETTERS, 2022, 43 (08) :1199-1202
[25]   Effect of the surface and barrier defects on the AlGaN/GaN HEMT low-frequency noise performance [J].
Vertiatchikh, AV ;
Eastman, LF .
IEEE ELECTRON DEVICE LETTERS, 2003, 24 (09) :535-537
[26]   Do all screw dislocations cause leakage in GaN-based devices? [J].
Wang, Jin ;
You, Haifan ;
Guo, Hui ;
Xue, Junjun ;
Yang, Guofeng ;
Chen, Dunjun ;
Liu, Bin ;
Lu, Hai ;
Zhang, Rong ;
Zheng, Youdou .
APPLIED PHYSICS LETTERS, 2020, 116 (06)
[27]   Gate leakage mechanisms in normally off p-GaN/AlGaN/GaN high electron mobility transistors [J].
Xu, Ning ;
Hao, Ronghui ;
Chen, Fu ;
Zhang, Xiaodong ;
Zhang, Hui ;
Zhang, Peipei ;
Ding, Xiaoyu ;
Song, Liang ;
Yu, Guohao ;
Cheng, Kai ;
Cai, Yong ;
Zhang, Baoshun .
APPLIED PHYSICS LETTERS, 2018, 113 (15)
[28]   Reconfigurable Radio-Frequency High-Electron Mobility Transistors via Ferroelectric-Based Gallium Nitride Heterostructure [J].
Yang, Jeong Yong ;
Yeom, Min Jae ;
Lee, Jaeyong ;
Lee, Kyusang ;
Park, Changkun ;
Heo, Junseok ;
Yoo, Geonwook .
ADVANCED ELECTRONIC MATERIALS, 2022, 8 (09)
[29]   The DC Performance and RF Characteristics of GaN-Based HEMTs Improvement Using Graded AlGaN Back Barrier and Fe/C Co-Doped Buffer [J].
Yang, Ling ;
Hou, Bin ;
Jia, Fuchun ;
Zhang, Meng ;
Wu, Mei ;
Niu, Xuerui ;
Lu, Hao ;
Shi, Chunzhou ;
Mi, Minhan ;
Zhu, Qing ;
Lu, Yang ;
Ma, Xiaohua ;
Hao, Yue .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2022, 69 (08) :4170-4174
[30]   Back Barrier Trapping Induced Resistance Dispersion in GaN HEMT: Mechanism, Modeling, and Solutions [J].
Yu, Hao ;
Parvais, B. ;
Peralagu, U. ;
ElKashlan, R. Y. ;
Rodriguez, R. ;
Khaled, A. ;
Yadav, S. ;
Alian, A. ;
Zhao, M. ;
Braga, N. de Almeida ;
Cobb, J. ;
Fang, J. ;
Cardinael, P. ;
Sibaja-Hernandez, A. ;
Collaert, N. .
2022 INTERNATIONAL ELECTRON DEVICES MEETING, IEDM, 2022,