Closed-loop identification of wafer temperature dynamics in a rapid thermal process

被引：0
作者：
Wonhui Cho
Thomas F. Edgar
Jietae Lee
机构：
[1] University of Texas,Department of Chemical Engineering
[2] Kyungpook National University,Department of Chemical Engineering
来源：
Korean Journal of Chemical Engineering | 2006年 / 23卷
关键词：
Rapid Thermal Process; Wafer Temperature; Closed-loop Identification; First Order Plus Time Delay Model;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Single wafer rapid thermal processing (RTP) can be used for various wafer fabrication steps such as annealing, oxidation and chemical vapor deposition. A key issue in RTP is accurate temperature control, i.e., the wafer temperatures should be rapidly increased while maintaining uniformity of the temperature profile. A closed-loop identification method that suppresses RTP drift effects and maintains a linear operating region during identification tests is proposed. A simple graphical identification method that can be implemented on a field controller for autotuning and a nonlinear least squares method have been investigated. Both methods are tested with RTP equipment based on a design developed by Texas Instruments.
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页码：171 / 175
页数：4
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